Translation of "Anätzen" in English

However, before the reaction, it can also be activated, for example by etching.

Surface roughness can be produced, for example, by etching.

Initial etching is effected by an acidic solution having oxidative activity.

Hydrophilation can be accomplished, e.g; by etching.

It may also be structured chemically by etching using a solvent.

Diluted hydrofluoric acid is usually utilized for chemical etching of the surface of a glass fiber.

Etching with HF increases the hydrophilic properties and thus the photocatalytic activity.

To determine the photosensitivity, the last step of the original visible after etching is recorded in each case.

Their "inclusion channel" is then made visible under the microscope by etching (Fig. 5).

Etching into the surroundings and a possible short-circuit to underlying structures can be precluded.

The insulator-free regions are produced uniformly during the etching, and etching into the bit lines is minimized.

For this purpose, functional groups are formed by etching the polymer with an acid.

Simple degreasing is sufficient, and the environmentally objectionable, expensive etching of the PTFE sealing member may be dispensed with.

Suitable activation methods are, for example, surface etching, increasing the surface area or chemical modification of the inside surface of the gelling mould.

The exposed oxide layer is preferably etched with ammonium fluoride buffer, in particular 1 buffer:16 water.

In individual cases it has proven to be appropriate to roughen the substrate surface, especially by etching,

In this process step, called “etching”, the anode according to the invention is the cathode.

If the total polishing time necessary for achieving the desired degree of polish for the batch in question has increased by a certain proportion, for example, by 25 to 50%, or if the first signs of polishing flaws, such as bluish discolouration or etching have shown themselves, sodium chloride and/or potassium chloride are added to the polishing bath in accordance with the invention which, in most cases, causes the polishing flaws on the batch just treated to disappear again immediately.

After drilling or punching the holes, the surface of the insulating material is appropriately prepared for chemical plating and, if appropriate, electroplating, by cleaning, slight etching, seeding with metal nuclei, etc., as is known in the art, since at this point of the process, the indicated steps can be carried out in an economical manner.

It is not obvious to the specialist that plastic surface which reacts sensitively after the conditioning can be dried repeatedly without difficulties and exposed to the effects of various solutions such as developer solutions for photoresist, cleaning solutions containing wetting agents and the oxidizing solutions for the etching of the metal film before the process step of activation, without thereby losing the capacity for the usable acceptance of the precious metal.

If, in a mass-production process, Ta is first deposited over an insulating piece of glass or porcelain to be separated in a last process step into individual capacitive humidity sensors, and then patterned by photolithographic techniques and wet-etched to form the bottom electrodes and contact areas, it is recommended to deposit a Ta2 O5 etch-stop layer 4 over the entire surface prior to the etching step, so that etching of the insulating material is prevented.

When a polycide layer (composed of polysilicon layer 3 and a silicide layer 4) is to topically have a contact with a silicon substrate (buried contact), then a certain degree of incipient etching of the substrate cannot, of course, be avoided (see FIG. 1, arrow 13).

However, with a correct selection of the fluorine/chlorine ratio in a reactive etching gas, one can achieve a relatively high selectivity (up to about 100:1) of n+ -polysilicon:silicon substrate and, thus, keep the incipient etching of a substrate very low.

The exposed plate is developed in 5% NaHCO3 solution and the final step recorded is rendered more easily visible by etching the exposed parts of the copper with FeCl3.